| ALSI laser separation system |
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2001-present: Laser Separation System This machine is now in series production. This machine cuts chips from wafers at a high speed and with high accuracy, using a laser. The high accuracy is achieved with vibration isolation, contactless motors and thermal conditioning of the critical machine parts. A planar, frictionless motor moves the wafer with the utmost accuracy under the laser bundle. Keywords: Planar motor, laser optic, modularity, serviceability.
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