Nederlands - nl-NLEnglish (United Kingdom)
ALSI laser separation system

2001-present: Laser Separation System
Customer: ALSI (Advanced Laser Separation International)

This machine is now in series production. This machine cuts chips from wafers at a high speed and with high accuracy, using a laser. The high accuracy is achieved with vibration isolation, contactless motors and thermal conditioning of the critical machine parts. A planar, frictionless motor moves the wafer with the utmost accuracy under the laser bundle.

Keywords: Planar motor, laser optic, modularity, serviceability.